99,7% Alumina Wafer Polish Awo
Ohun elo
Gẹgẹbi didan wafer seramiki Alumina ati awọn disiki lapping oniyebiye ti a lo ninu ologbele-conductive, didan diamond ati bẹbẹ lọ.
Ilana: Gbogbo awọn oriṣi ti didan ati ilana lapping, gẹgẹ bi awọn didan ẹrọ kemikali CMP, didan ẹrọ, didan pipe.
Ẹya ara ẹrọ
Ga ti nw ati kemikali agbara
Ga darí Agbara ati líle
High Ipata Resistance
High Foliteji Resistance
Sooro otutu giga Titi di 1700ºC
Lalailopinpin Abrasion Resistance Performance
O tayọ idabobo Performance
Gbogbo iru Iwọn 180,360, 450, 600mm ati be be lo
| Orukọ ọja | 99.7 giga ti nw Alumina seramiki didan Lapping Disiki |
| Ohun elo | 99,7% aluminiomu |
| Iwọn deede | D180, 360, 450, 600mm, adani iwọn gba. |
| Àwọ̀ | Eyo |
| Ohun elo | Wafer ati oniyebiye CMP ilana ni ologbele-conductive ile ise |
| Min. Bere fun | 1 Aworan |
Kemikali / ti ara Alaye
| Ẹyọ | 99.7 Alumina ohun elo | ||
| Gbogbogbo Properties | Al2O3 akoonu | wt% | 99.7-99.9 |
| iwuwo | gm/cc | 3.94-3.97 | |
| Àwọ̀ | - | Eyo | |
| Gbigba omi | % | 0 | |
| Darí Properties | Agbara Flexural (MOR) 20ºC | Mpa (psix10^3) | 440-550 |
| Modulu Rirọ 20ºC | GPA (psix10^6) | 375 | |
| Vickers Lile | Gpa (kg/mm2) R45N | >=17 | |
| Titẹ Agbara | Gpa | 390 | |
| Agbara Fifẹ 25ºC | MPa (psix10^3) | 248 | |
| Lile Egugun (KI c) | Mpa* m^1/2 | 4-5 | |
| Gbona-ini | Imudara igbona (20ºC) | W/mk | 30 |
| Olusọdipúpọ ti Imugboroosi Gbona (25-1000ºC) | 1x 10^-6/ºC | 7.6 | |
| Gbona mọnamọna Resistance | ºC | 200 | |
| O pọju lilo iwọn otutu | ºC | 1700 | |
| Itanna-ini | Agbara Dielectric (1MHz) | ac-kv/mm(ac v/mil) | 8.7 |
| Dielectric Constant(1 MHz) | 25ºC | 9.7 | |
| Resistivity iwọn didun | ohm-cm (25ºC) | >10^14 | |
| ohm-cm (500ºC) | 2×10^12 | ||
| ohm-cm (1000ºC) | 2×10^7 |
Iṣẹ
A gba awọn ibere aṣa.
Ti o ba fẹ mọ alaye ọja diẹ sii, jọwọ lero ọfẹ kan si wa ati pe a yoo fun ọ ni ọja to dara julọ ati iṣẹ to dara julọ!
ọja Tags
Kọ ifiranṣẹ rẹ nibi ki o si fi si wa
